Optimization of Semiconductor Device Packaging Singulation Process

Semiconductor Packaging Assembly Technology

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

Rigorous integration of semiconductor process and device simulators

We deal with problems arising in the coupling of process and device simulators. It is analyzed what kind of data and algorithms such simulations are based on. An overview of existing technology computer-aided design data models is given. A generic object-oriented data model suitable for three-dimensional process and device simulations, the so-called WAFER-STATE-SERVER is presented. By taking ad...

Strain induced semiconductor nanotubes: from formation process to device applications

Semiconductor nanotubes (SNTs) represent a new class of nanotechnology building blocks. They are formed by a combination of bottom–up and top–down approaches, using strain induced self-rolling mechanism from epitaxially grown heterojunction films. This review summarizes several aspects of this emerging field, including the SNT formation process, its dependence on crystal orientation, strain dir...

Validating Medical Device Packaging

Using Quality Function Deployment in Singulation Process Analysis

This paper presents the application of quality function deployment (QFD) to process analysis. QFD has been applied in various industries since the 1960s, but traditional QFD methodologies still have many limitations. An improved QFD framework is proposed, in which, customer requirements are identified through value engineering and strategic analysis. Process mapping using the IDEF methodology i...